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Tolapai is the code name of Intel's system-on-a-chip (SoC) embedded processor which combines an x86 processor core, DDR2 memory controllers and I/O controllers, and a QuickAssist Integrated Accelerator unit for security functions.

The Tolapai Embedded processor will have 148 million transistors, 1088-ball FCBGA with a 1.092mm pitch, and come in a 37.5mm x 37.5mm package. This will also be Intel's first integrated x86 processor, chipset and memory controller since 1994's 80386EX.

Intel® EP80579 Integrated Processor for Embedded Computing

* CPU -- Pentium M clocked from between 600MHz and 1.2GHz
* Cache -- 256KB
* Package -- 1088-ball Flip Chip BGA
* Memory -- DDR2 from 400- to 800 MHz; MCH supports DIMM or memory down with optional 32-/64-bit and ECC configurations
* Bus -- One local expansion bus for general control or expanded peripheral connections
* PCI Express -- PCIe root complex interface in 1x8, 2x4, or 2x1 configurations
* Storage -- 2 x SATA (Gen1 or Gen2) interfaces
* Networking -- 3 x 10/100/1000 Ethernet MACs supporting RGMII or RMII, and Management Data Input/Output (MDIO)
* USB -- 2 x USB (1.1 or 2.0) interfaces
* GPIO -- 36 x General-Purpose I/O (GPIO) ports
* CAN -- 2 x CAN 2.0b interfaces
* High Speed Serial -- 3 x HSS ports for T1/E1 or FXS/FXO connections
* Serial -- 1 x synchronous serial port (SSP)
* UARTS -- 2 x 16550-compatible UARTs
* SMB -- 2 x System Management Bus (SMBus) interfaces
* LPC -- 1 x Low Pin Count (LPC 1.1) interface
* SPI -- 1 x Serial Peripheral Interface Bus (SPI) boot interface
* RTC -- Integrated real-time clock (RTC) support
* EDMA -- Enhanced DMA (EDMA) engine with low latency memory transfers; supports multiple peer-to-peer configurations
* Operating temperature -- 0 to 70 degrees C (most models); -40 to 85 degrees C (some models)